Jiangsu Juming Chemical Technology Co., Ltd.

JMZG-9000 Vinyl-terminated Low Molecular Weight Polyphenylene Ether (PPE/PPO) Polymer Chain(Chinese electronic-grade PPO/PPE resin)

Product Description

1. Product Selection at a Glance

Parameter	JMZG-9000
End-group chemistry	Methacrylate / vinyl terminated
Functionality	Bi-functional
Cure mechanism	Free-radical co-cure with styrene, allylic, acrylic, maleimide, methacrylic, unsaturated polyester
Typical formulation role	Base resin for non-epoxy / halogen-free, high-Tg systems
Mn (number-average)	2300
Tg (half width)	160 °C
Key functional index	Vinyl functionality ≈ 1.9
Physical form	Powder
Specific gravity	1.02
Intrinsic viscosity	0.09 dl/g
Solubility, toluene @ 21 °C	≥ 50 wt%
Solubility, MEK @ 21 °C	≥ 50 wt%
Solution viscosity, 50 wt% in toluene @ 25 °C	≈ 298 cP
Solution viscosity, 50 wt% in MEK @ 25 °C	≈ 160 cP
Dk @ 1 MHz	2.54
Df @ 1 MHz	0.0007
Reference class	SABIC NORYL™ SA9000

2. Detailed Specification

JMZG-9000 — Methacrylate / Vinyl-Terminated PPE Oligomer

Property	JMZG-9000
Appearance	White to off-white powder
Mn (number-average MW)	2300
Intrinsic viscosity	0.09 dl/g
Vinyl functionality	1.9
Phenolic end-group content	≈ 300 ppm
Tg (half width)	160 °C
Specific gravity	1.02
Solubility in toluene @ 21 °C	≥ 50 wt%
Solubility in MEK @ 21 °C	≥ 50 wt%
Solution viscosity, 50 wt% in toluene @ 25 °C	≈ 298 cP
Solution viscosity, 50 wt% in MEK @ 25 °C	≈ 160 cP
Dielectric constant @ 1 MHz	2.54
Dissipation factor @ 1 MHz	0.0007

3. Solvent Compatibility

Solvent class	Soluble at 30 wt%, ambient	Not soluble	Solution stability note
Aromatic	Toluene, xylene, anisole	—	Clear after 7 days in toluene / anisole
Ketones	MEK, cyclohexanone, MIBK, MIAK	Acetone	Clear in cyclohexanone; cloudy in MEK
Esters	Methyl / ethyl / butyl / isopropyl / amyl acetate	—	Cloudy after 7 days
Ethers	THF, dioxane, 2-ethoxyethyl acetate	2-methoxyethanol, ethylene glycol monobutyl ether	THF / dioxane clear
Polar aprotic	DMAc, NMP	DMF	Cloudy; check for gelation in long storage
Alcohols	Butanol (only at elevated temperature)	Methanol, ethanol, IPA, ethylene glycol	Butanol settles on cooling
Reactive monomers	MMA, methyl acrylate, ethyl acrylate, butyl acrylate	—	Clear — enables monomer-diluted formulations
Acids	—	Acetic acid	—

4. Applications

4.1 Copper Clad Laminate & Prepreg (primary)

High-speed CCL — base resin component for M6 / M7 / M8 grade laminates used in 56G and 112G PAM4 channels, 400G / 800G switching, AI accelerator cards and high-end server motherboards.
Epoxy prepreg modification (JMZG-90) — reacts into the epoxy network through OH end groups, raising Tg, lowering Df and reducing moisture uptake.
Non-epoxy prepreg (JMZG-9000) — free-radical co-cure with unsaturated monomers for halogen-free, high-Tg systems.
Cyanate ester hybrid systems — rPPO/CE blends where PPE reduces Dk/Df while cyanate ester carries the thermal load.
Resin-coated copper (RCC) and build-up films for HDI substrates.

4.2 Electronic Packaging & Adhesives

Insulating materials requiring very low dielectric constant and low moisture absorption.
Protective coatings and potting compounds for high-frequency modules.
High-Tg adhesives and bonding films for multilayer PCB construction.
Underfill and encapsulant modification where low Df and low CTE are both required.

4.3 Industrial & Composite

High-frequency radome and antenna substrate resins (5G / 5G-A base station).
Composite matrices where low dielectric loss and dimensional stability matter.
Blending with thermoplastic elastomers and cured elastomers for property enhancement.

4.4 End-use market map

End market	Typical laminate grade	Why PPE oligomer is used
AI server / GPU accelerator boards	M7 – M8	224G-class channel budgets; PPE loading per unit area is several times that of conventional epoxy systems
800G / 1.6T network switches	M8 (and higher in development)	Insertion-loss budget leaves no margin for Df drift
5G / 5G-A base station	M4 – M6	Low Dk supports impedance control at mmWave
High-end networking backplane	M6 – M7	Layer count and thermal reliability (T288, Td)
High-frequency antenna / radome	PPE-modified composite	Low dielectric loss plus dimensional stability

5. Processing & Formulation Guidance

Dissolution. Pre-dissolve at up to 50 wt% in toluene or MEK under agitation at ambient temperature. Higher solids reduce solvent load but raise viscosity — check against your impregnation line window.
JMZG-90 route. Charge as a reactive polyol into epoxy, cyanate ester or isocyanate formulations. Stoichiometry should be calculated from the hydroxy equivalent weight (HEW), not from Mn alone.
JMZG-9000 route. Co-cure with unsaturated monomers under peroxide or thermal free-radical initiation. Compatible with styrene, allylic, acrylic, maleimide, methacrylic and unsaturated polyester systems, and with BMI/TAIC cross-linkers.
Copper foil interface. Very smooth (HVLP) copper foil combined with modified PPE can give poor peel strength. Peel promoters, BCB-containing systems or surface treatment are commonly required — validate peel strength alongside Df, since the two trade off against each other.

6. Packaging & Supply

Item	Specification
Documents	COA per batch, SDS, TDS. REACH status, halogen-free / RoHS declaration and ionic-residue report on request.

7. Frequently Asked Questions

Are JMZG-90 and JMZG-9000 drop-in replacements for SABIC NORYL SA90 and SA9000?: They are engineered to match the defining parameters of that oligomer class — Mn, end-group functionality, Tg, solution viscosity, solubility and dielectric behaviour. NORYL™ is a registered trademark of SABIC; these products are not manufactured by, endorsed by, or affiliated with SABIC. We recommend validating equivalence in your own formulation through incoming QC and laminate trials, and we supply full COA with matched test methods to support that validation.
What dielectric performance can be expected?: The neat oligomer is designed to a dielectric constant of approximately 2.54 and dissipation factor of approximately 0.0007 at 1 MHz. Dk and Df are frequency dependent — values at 10 GHz are not the same as at 1 MHz. Final laminate performance depends on the complete formulation, filler system, glass fabric and copper foil.
Which CCL speed grades are these suited for?: Functionalized low-molecular-weight PPE oligomers are the mainstream base resin for the high-speed laminate grades commonly designated M6, M7 and M8, covering 56G/112G PAM4, 400G/800G switching, AI accelerator boards and high-end servers. Grade selection depends on the loss budget of the specific design.
How do the hydroxyl and vinyl grades differ in use?: JMZG-90 (hydroxyl-terminated) is a reactive component for step-growth thermosets — epoxy, cyanate ester, polyurethane and isocyanate systems — reacting through its OH end groups. JMZG-9000 (vinyl/methacrylate-terminated) co-cures by free-radical reaction with unsaturated monomers and resins, and is the preferred route for non-epoxy, halogen-free, high-Tg formulations.

Benzocyclobutene CAS 694-87-1

JMZG-90 Low Molecular Weight Polyphenylene Ether Resin(Chinese alternative for electronic-grade PPO/PPE resins)

JMZG-9000 Vinyl-terminated Low Molecular Weight Polyphenylene Ether (PPE/PPO) Polymer Chain(Chinese electronic-grade PPO/PPE resin)

We have a professional export team and our chemicals are exported to European、Asia and American countries. We can do OEM and ODM services. We have a chemicals develop team that develops and designs new chemicals every year.

E-mail: sales@juminghem.com

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